Calidad Módulo WiFi7 & Módulo WiFi HaLow Fabricante

The global smart street light market is undergoing a structural expansion. A report released by Research and Markets in January 2026 shows that the market is projected to grow from $35.6 billion in 2026 to $74.9 billion in 2030, representing a CAGR of 20.4%. Europe is accelerating the renovation of existing infrastructure driven by mandatory replacement policies, while emerging markets in the Asia-Pacific region are releasing incremental demand through urbanization. However, a overlooked fact is that market expansion does not equate to simpler communication solution selection. On the contrary, as the focus of renovation shifts from "new construction" to "existing infrastructure," the primary constraint on communication solutions changes from technical specifications to the question: "Can this road be dug?" The position of PLC (Power Line Carrier Communication) under this constraint is clear: the streetlights themselves are connected to the power line, the PLC uses the same cable as both a power supply and data channel, and the communication signal is transmitted along the existing line without the need for any additional communication cables. Europe: Policy mandates have created the most certain scenarios for upgrading existing PLC systems. Europe is the region with the strongest policy drive for smart street light upgrades globally. A 2026 report by Mordor Intelligence points out that the EU's Mercury Regulation 2024/1849 requires the complete phase-out of compact fluorescent lamps by December 2025 and linear fluorescent lamps by December 2026. These compliance deadlines directly triggered a surge in municipal tenders. Simultaneously, the EU requires the public sector to reduce energy consumption by 11.7% by 2030, transforming the transition to network-connected LED lighting from an "optional" to a "compliance necessity." The unique aspect of this policy window is that it targets "replacement of existing infrastructure" rather than "new construction." Many streetlights in Europe were installed decades ago, with intact power cables but missing communication cables. Adopting a solution requiring separate communication cabling would mean excavating or re-laying conduits along the entire route, resulting in unpredictable costs and time. The ability of PLCs to reuse existing power cables perfectly matches the policy's mandated time pressure with the construction constraints of upgrading existing infrastructure. German practice provides a reference: the LED upgrade of 48,000 streetlights in Munich, combined with adaptive dimming, reduced energy consumption by 93% during off-peak hours. For these types of projects, communication reliability is more important than bandwidth; the millisecond-level latency of PLCs and the engineering advantages of no-wiring are more significant than wireless solutions in this scenario. However, the European market also presents a strict cost scrutiny. Smart retrofitting costs between €300 and €500 per pole, while basic LED replacement only costs €150 to €200. This price difference means that the selection of PLC modules must withstand scrutiny regarding the question of "why not use wireless?" The answer lies not in technological superiority, but in the engineering certainty under existing wiring conditions : wireless solutions are affected by terrain and building obstructions in dense urban areas, requiring additional relay nodes in practical testing, while PLCs, assuming the power supply cable is intact, have a physically existing communication link.   China and Asia Pacific: Differences in PLC Positioning in Incremental Markets Data from China's smart light pole market presents a different picture. QYResearch statistics show that the global smart city light pole market sales reached approximately $412 million in 2025 and are projected to reach $796 million by 2032, representing a compound annual growth rate of 10.0%. Unlike Europe's "replacement of existing stock," China's growth is largely driven by new "multi-purpose" projects: light poles simultaneously serve functions such as lighting, monitoring, 5G micro base stations, and environmental monitoring. Communication solutions tend to favor fiber optic or wireless backhaul because the civil engineering of the light pole itself is already included, thus amortizing the marginal cost of laying separate communication cables. This means that the main opportunity for PLCs in the Chinese street lighting market lies not in "building new smart light poles," but in the niche scenario of "energy-saving retrofitting of existing road lighting." Many urban roads in China only have power cables in their lighting circuits, lacking communication lines. If only single-lamp control, dimming, and fault feedback are required, PLCs offer better engineering economics than rewiring. A study published in the 8th issue of *China Lighting Appliances* in 2026 points to this logic: traditional control modes are energy-intensive and difficult to maintain, while mainstream wireless communication solutions are easily affected by terrain obstruction in densely populated urban areas. PLCs, utilizing existing cables for data transmission, offer advantages such as low cost and reliable connection. The Southeast Asian market is in an earlier stage. In March 2026, Terengganu, Malaysia, installed the state's first 5G smart lamppost at the Kedebayan Market, integrating smart lighting, monitoring, environmental monitoring, and electric vehicle charging functions. These markets share common characteristics: real incremental demand, but projects are small-scale, budgets are fragmented, and there is a higher sensitivity to module costs than to brand premiums. In these markets, PLC modules are more likely to follow lighting solution providers overseas rather than independently building brand recognition.   The strategic position of the Qogrisys S130N-ISI in this landscape The product parameters of the S130N-ISI need to be understood within the context of the aforementioned market differences. It is based on the Leadcore VC6330, with an LCC package size of 20.6×12.6mm, supports both Q/GDW 11612 and IEEE 1901.1 protocols, and provides UART, PWM, GPIO, ADC, and SPI interfaces, integrating a built-in wire driver. According to official data from Leadcore regarding the VC6330 chip, application-layer communication rates can reach 1Mbps, with attenuation resistance exceeding 112dB, and a 99.99% communication success rate in actual projects. These parameters address the question of "whether it can be used," but the "usability" in different markets depends on the line conditions and system integration quality. The aging of the lines in European projects, the distribution of interference sources in Chinese projects, and the differences in construction specifications in Southeast Asian projects all affect the actual performance of the PLC. In street lighting scenarios, the value of the S130N-ISI lies not in promising "it will work immediately after installation," but in providing a hardware option that meets basic engineering requirements in three dimensions: protocol matching (Q/GDW 11612, IEEE 1901.1), size adaptation (20.6×12.6mm can be embedded in a single lamp controller), and interface integration (PWM dimming, ADC acquisition). One fact that requires careful consideration is that publicly available authoritative data on the actual global adoption rate of PLCs in smart streetlights is limited. What can be confirmed is that PLCs are one of the official options for smart streetlight connectivity, with academic research and engineering practice supporting their feasibility under specific conditions. However, conclusions such as "PLCs will dominate streetlight communication" lack data support. For engineering teams evaluating solutions, a more pragmatic approach is to test the wiring first, then select the modules. Only when the line impedance and signal-to-noise ratio are within reasonable ranges can the wiring-free advantage of PLCs translate into savings in construction time and costs; if test results are unsatisfactory, the costs of forcing PLC implementation may only become apparent during the commissioning phase.   Conclusion: The window of opportunity belongs to solution providers who clearly explain the "constraints". The global smart street light market's 20.4% CAGR provides a real window, but this window opens differently in different regions. In Europe, mandatory policies have created a definite demand for retrofitting existing infrastructure, where the wiring-free advantage of PLCs has the clearest engineering logic. In China, incremental growth is concentrated in the construction of new multi-functional light poles, where PLCs have opportunities in the energy-saving retrofitting of existing roads. In Southeast Asia, the early-stage market is testing the cost competitiveness of modules. In this context, the S130N-ISI isn't a "universal street light module," but rather a PLC hardware option that adapts to the needs of single-lamp controllers in terms of protocol, size, and interface. Its value lies not in the absolute values of its specifications, but in its compatibility with the specific project's wiring conditions. For the engineering team, this means resolving the "do we need to break the road?" question at the project initiation meeting, rather than discovering during the commissioning phase that line noise is causing communication success rates far below expectations. Testing the line first, then selecting the module—reversing this order might save you a quote, but cost you the entire road's commissioning time.  

I. The Real-World Coordinates of the Wi-Fi 8 Standard Progress Just two days ago, Qualcomm's Dragonwing platform released a signal at Network X 2026 – the Wi-Fi 8 gateway solution was launched. To understand this, we need to clarify the current standard stage of Wi-Fi 8. At the IEEE plenary meeting in Montreal in July 2026, the 802.11bn task force voted to submit Draft 2.0 to the working group for a vote, thus finalizing the core features of Wi-Fi 8. According to the timeline disclosed by ABI Research, Draft 3.0 voting is scheduled for January 2027, Draft 4.0/initial standards association voting is targeted for May 2027, final working group approval is set for March 2028, IEEE standards committee approval is expected for May 2028, and the Wi-Fi Alliance certification program is expected to launch in January 2028. The key implication of this timeline is that Wi-Fi 8 will still be in the draft standard stage in 2026, with certified products and large-scale commercialization not truly starting until 2028. However, chip platform and module solution providers have already significantly accelerated their product development pace. Broadcom was the first to release Wi-Fi 8 chipsets in October 2025, followed by MediaTek and Qualcomm. By September 2026, the Wi-Fi Alliance had already held its first Wi-Fi 8 pre-certification interoperability Plugfest in Beijing, Taipei, and California. While the standard has not yet been finalized, the industry's engineering preparations are already in full swing. II. The Differentiated Deployment Logic of Qualcomm's Dragonwing Platform Qualcomm's Dragonwing product portfolio, showcased at Network X 2026, presents a clear market segmentation strategy. designed for mainstream fiber broadband gateways . According to Qualcomm's official product briefing, the F8 integrates Wi-Fi 8 connectivity and native PON architecture support, targeting Home Gateway Units (HGUs) and Single Units (SFUs). Key specifications include: peak wireless capacity of 23Gbps, support for up to 750 concurrent clients, up to three-band operation and a 14-antenna configuration , flexible RF configuration allowing for a 5x5 mode or splitting into dual-band simultaneous 2x2+3x3 modes, and native support for GPON, XG-PON, and XGS-PON standards. The platform supports open-source middleware such as prplOS, OpenWRT, RDK, and OpenSync, and is equipped with a dedicated scanning radio frequency for automatic channel selection and radar detection. designed for high-end enterprise access points (APs) and flagship home routers . Its specifications are significantly improved: peak wireless capacity of 33Gbps, support for up to 1500 concurrent clients, up to five frequency bands and a 20-antenna configuration , integrated five-core CPU and Hexagon NPU, and support for edge AI inference. Developed in collaboration with GFiber, this platform, a Wi-Fi 8 Premium Gateway, aims to support symmetric 20Gig broadband services, redefining the gateway from a "connected device" to a "smart service platform." Meig Smart chose to launch its Wi-Fi 8 gateway solution on the N8 platform, officially announcing it at Network X 2026 on October 14th. The industry significance of this launch lies in the fact that the entire engineering transformation chain of a Wi-Fi 8 gateway, from chip platform to deliverable solution, has been fully demonstrated for the first time. For downstream customers, the Wi-Fi 8 gateway is no longer a distant concept "waiting for the standard to be finalized," but rather an evaluable chip base and a referenceable solution design. III. Generational Positioning of Qogrisys Gateway Module Product Line Although manufacturers are currently rushing to implement their strategies in advance, WiFi 7 and WiFi 6 remain the mainstays of shipments. They are more mature than WiFi 8 and are still the preferred choice. During this window of opportunity before the Wi-Fi 8 standard is finalized, gateway module solution providers need to strike a balance between technological foresight and market deliverability in their product strategies. Qogrisys's two main gateway module products are precisely designed to meet different levels of demand during this transition period. Wi-Fi 7 Platform: O2072PM and O2072PB The O2072PM is based on the Qualcomm FastConnect C7700 (QCC2072) chip, uses a standard M.2 Key E interface (22×30mm), and supports Wi-Fi 7 (802.11be) and Bluetooth 6.0. Its core capabilities include: tri-band 2.4/5/6GHz concurrent operation; the 6GHz band supports 320MHz channel bandwidth and 4096QAM modulation, with a peak rate of 5.8Gbps ; and it supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) , enabling millisecond-level switching when the link is interfered with. This module has completed driver adaptation for Intel x86 platforms with kernels 5.15.24+, 6.1.99, and 6.12.0. The O2072PB is based on the same QCC2072 chip and uses a 15×13mm surface mount package, targeting space-constrained onboard integration scenarios. Wi-Fi 6E Platform: O2066PM and O2066PB The O2066PM is based on the Qualcomm QCA2066 chip and uses a standard M.2 2230 Key E interface (22×30×2.7mm), supporting Wi-Fi 6E (802.11ax) and Bluetooth 5.2. Key specifications include: tri-band 2.4/5/6GHz support, dual-band simultaneous (DBS) operation, and a maximum speed of 2975.6Mbps ; support for 2×2 MU-MIMO, 160MHz channel bandwidth, and dynamic frequency selection (DFS radar detection). The Bluetooth interface supports both UART/PCM and USB configurations. The module operates in a temperature range of -30℃ to +85℃ , exhibiting industrial-grade stability. In VR products, it has achieved a measured throughput of 2.1Gbit/s and has been designed into customer VR products, which were showcased at CES 2023. The O2066PB is based on the same QCA2066 chip, and its core capabilities are identical to the O2066PM; the difference lies in its package form. It uses a small SMT LGA package, measuring 13×15×2.3mm , targeting space-constrained onboard integration scenarios. Wi-Fi uses a PCIe interface, and Bluetooth uses a UART/PCM interface. Its operating temperature range is -30℃ to +70℃ , making it suitable for consumer-grade terminal devices. the O2072 series is logically consistent with the "high reliability connection" emphasized by Wi-Fi 8—Wi-Fi 7's MLO provides an engineering implementation of link redundancy, while Wi-Fi 8's Multi-AP Coordination (MAPC) extends the coordination scope from a single device to a multi-node network. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-end and mid-range gateways, Wi-Fi 6E's 6GHz band capability provides cost-sensitive customers with a "partial generational upgrade" option . IV. Generational Transition Logic Between Chip Platforms and Module Products From Wi-Fi 6E to Wi-Fi 7 and then to Wi-Fi 8, the technological evolution path of gateway modules shows a clear continuity. The core improvement of Wi-Fi 8 over Wi-Fi 7 lies not in peak speed . According to industry technical analysis, Wi-Fi 8 is compatible with Wi-Fi 7's 2.4/5/6GHz tri-band, 320MHz channel, and 4096QAM. Existing Wi-Fi 7 RF architectures can support these core features through firmware upgrades . Wi-Fi 8 offers approximately double the actual throughput and reduces P99 latency to about one-sixth of Wi-Fi 7. Its core value lies in reliability, coverage, and concurrency efficiency in high-density/long-distance scenarios , achieved through multi-AP collaboration, dynamic resource scheduling, and enhanced link design. Wi-Fi 7 addressed "speed," while Wi-Fi 8 addresses "stability." The eMLSR multi-link operation capability and tri-band concurrent architecture already possessed by the O2072 series from Qogrisys are engineering implementations on the Wi-Fi 7 platform. As the Wi-Fi 8 MAPC protocol stack and enhanced long-range response (ELR) features mature, module products based on the Wi-Fi 7 RF architecture have the engineering foundation to migrate to Wi-Fi 8 features at the hardware level . The core challenges lie in upgrading the software protocol stack and implementing multi-AP coordination functions. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-to-mid-range gateways, the 6GHz band capability of Wi-Fi 6E provides cost-sensitive customers with a "partial generational upgrade" option . V. Conclusion Qualcomm's Dragonwing platform was publicly launched as a Wi-Fi 8 gateway solution during Network X 2026, marking the transition of Wi-Fi 8 from the standard draft and chip prototype stages to the gateway product engineering stage . Meig Smart's solution release validates the transformation path from chip platform to deliverable gateway, and also indicates that the competitive pace among module solution providers has shifted from "following after the standard is frozen" to "parallel development during the standard draft stage." For gateway module solution providers, the core task at this stage is not to "get a head start" on the Wi-Fi 8 platform, but to accumulate transferable engineering capabilities on the Wi-Fi 7 and Wi-Fi 6E platforms. The experience of O2072PM / O2072P B in eMLSR multi-link operation, the accumulated RF engineering expertise in tri-band concurrent architecture, and the cost optimization path of O2066PM / O2066P B in the 6GHz band together constitute the product positioning for the transition to the Wi-Fi 8 era. From a longer-term perspective, Wi-Fi 8 redefines the gateway from a "wireless coverage device" to an "access node in a multi-AP coordinated network." This role change requires module solution providers to extend their capabilities beyond simple RF engineering and driver adaptation to system-level capabilities such as network topology planning, multi-node collaborative scheduling, and deployment scenario adaptation. During the standard window of 2026-2027, module solution providers' product strategies need to find a balance between "technological foresight" and "current deliverability"—Wi -Fi 7 modules serve current high-end gateway needs, Wi-Fi 6E modules cover cost-sensitive scenarios, and Wi-Fi 8 productization preparation needs to be quickly integrated as soon as the chip platform becomes available.  

I. La lógica de aceptación ha cambiado: de "si está instalado o no" a "solo cuenta si está probado". Los proyectos fotovoltaicos en techos en Shenzhen están experimentando una mejora sustancial en los estándares de aceptación.que establece indicadores cuantitativos precisos para el cierre rápido: la acción de apagado deberá completarse en un máximo de 30 segundos, la tensión dentro de un rango de 1 metro de la matriz fotovoltaica deberá descender a menos de 80 V,y el voltaje fuera de 1 metro debe caer por debajo de 30V. Esto no es algo que pueda ser simplemente descartado como "instalar apagado rápido". El personal de recepción en el sitio primero localizará todos los puntos de disparo de apagado,confirmación de la coherencia de la lógica en las salidas de incendios, cerca del inversor y en el terminal de control remoto; luego comprobar la correspondencia entre los dispositivos de apagado y los componentes; finalmente,registrar el tiempo y el voltaje en los puntos de medición especificados en los dibujos, confirmando que el límite de la matriz, tanto dentro como fuera de la versión adoptada del proyecto, cumple con los requisitos.El simple hecho de decir "RSD está escrito en la lista de materiales" ya no es suficiente para la aceptación; el rendimiento de control de voltaje a nivel del sistema es el criterio final. La norma del grupo de Shanghai T/ESETA 0000072026 perfeccionó aún más los requisitos: el apagado debe completarse en un plazo de 30 segundos después del desencadenamiento,y el voltaje externo del límite alcanzable debe ser ≤ 30V, la tensión interna debe ser ≤ 120V y la potencia de salida ≤ 1W. También se indica claramente que "el apagado se divide en nivel de componente y nivel de cadena,Las soluciones a nivel de componentes deben tener prioridad en lugares densamente poblados." El mercado norteamericano tiene barreras de entrada más estrictas. NEC 690.12 requiere que los conductores controlados fuera del límite de la matriz deben caer por debajo de 30V dentro de 30 segundos.y que la protección contra los choques eléctricos para los bomberos dentro del límite debe lograrse mediante un dispositivo PVHCS o un método de limitación de voltaje enumerados..Al seleccionar una solución PLC, el método de modulación del chip y la inmunidad al ruido determinan directamente el número de componentes que el sistema puede soportar. II. La lógica jerárquica de SunSpec: cumplimiento del chip ≠ certificación del módulo ≠ aprobación completa del sistema Este es un problema crítico que es más fácil de pasar por alto por los fabricantes de interruptores y compradores de módulos. La especificación de la Alianza SunSpec "Signales de comunicación para apagado rápido" define el protocolo de comunicación entre el transmisor y el receptor:el transmisor envía continuamente una señal en un estado "operativo"La Alianza SunSpec declara explícitamente:"Sólo la marca 'SunSpec Certified' prueba la implementación completa y exitosa de la especificación de funcionalidad de señal de comunicación de apagado rápido SunSpec.Las declaraciones de "conformidad con SunSpec" o "compatibilidad con SunSpec" de los fabricantes u otros terceros no son equivalentes a un certificado expedido por SunSpec.." Esto significa queEl soporte de chips para protocolos, la prueba de conformidad de módulos y la certificación completa del dispositivo son tres niveles de verificación independientes. La compatibilidad del protocolo a nivel de módulo es solo el primer obstáculo; las certificaciones de seguridad como UL 1741 y CSA C22.2 a nivel de unidad completa son los pasaportes para ingresar al mercado.Esta comprensión es crucial para las decisiones de selección de los fabricantes de interruptores.   III. Tres dimensiones de ingeniería para la selección de módulos: tamaño, consumo de energía y capacidad de red Para los fabricantes de interruptores, las características de "apoyo de PLC" y "conductor de línea integrado" en las especificaciones del chip son solo el punto de partida.Lo que realmente determina si una solución puede ser producida en serie e implementada es la adaptabilidad de la ingeniería a nivel de módulo. La primera es el tamaño.El interruptor está instalado en el panel trasero de cada módulo fotovoltaico, donde el espacio es extremadamente limitado, y comparte este espacio limitado con cajas de conexión y cables.El tamaño del paquete del módulo determina directamente el espacio de diseño y el método de instalación de la carcasa del interruptorLos módulos de control automático que utilizan el chipset Hisilicon PS0211 suelen utilizar un paquete de encabezado de alfiler de 28,12 × 18,00 mm o un paquete de dedo de oro de 20,0 × 14,2 mm,Mientras que algunos fabricantes de módulos han lanzado una versión más miniaturizada de 20.0 x 11.0 mm. La segunda dimensión es el consumo de energía.El dispositivo de apagado es alimentado por el propio panel fotovoltaico y no tiene entrada de energía independiente.Estado que no envía paquetes), y la potencia de funcionamiento dinámica es ≤ 0,5 W. Durante los períodos de insuficiente luz solar, cuando los módulos están sombreados o por la noche,el módulo debe depender de un consumo de energía de espera extremadamente bajo para mantener su capacidad de monitoreo., esperando la señal de "operación permitida" enviada por el transmisor del inversor. La tercera dimensión es la capacidad de redes.Las señales de PLC se transmiten a través de líneas de alimentación de CC, y el dispositivo de apagado, que actúa como un nodo STA, necesita establecer un enlace de comunicación confiable con el CCO en el extremo del inversor.La solución HiSilicon PS0211 admite una red rápida en 10 segundos en un nodo típico de 200, escenario de red de dos niveles, que admite enrutamiento dinámico y direccionamiento de múltiples rutas, y métodos de propagación de comandos unicast, multicast y broadcast.Para el requisito de acceso unificado para múltiples componentes y dispositivos en sistemas fotovoltaicos distribuidos,la escala de red y el rendimiento temporal de los módulos afectan directamente a la eficiencia de puesta en marcha del sistema;. IV. Alineación de la escena de dos módulos PLC desde¿Qué es eso? En la selección de módulos PLC de apagado fotovoltaico, Qogrisysy ofrece dos productos basados en diferentes soluciones de chips, cada uno correspondiente a diferentes enfoques de ingeniería. el S130N-ISI (solución VC6330 de Linktronics)Este módulo utiliza envases LCC, con un tamaño de PCB controlado en 12.6×20.6×2.5mm.Funciona en temperaturas que van desde -20°C hasta 80°C y en temperaturas de almacenamiento desde -40°C hasta 125°C, que admite el ancho de banda SGCC de 0 a 12 MHz y el protocolo de comunicación IEEE 1901.1.Para los diseños de equipos de interrupción con espacio extremadamente limitado, el tamaño físico del módulo es a menudo el primer obstáculo de detección. Para el diseño de recintos de unidades de apagado rápido (RSU) donde el espacio es severamente limitado, las dimensiones físicas del módulo a menudo sirven como criterio de selección principal.,La compatibilidad de ingeniería a nivel de módulo es más crítica que los parámetros específicos del chip:la unidad está montada en la parte posterior del módulo fotovoltaico – un área con un espacio extremadamente limitado – y es alimentada por el propio panel fotovoltaico, lo que requiere que monitoree continuamente las señales del PLC mientras opera a una consumo de energía de microvatio.y fiabilidad en un amplio rango de temperaturas determinan directamente si la RSU completa puede funcionar de manera estable en entornos reales de techo. V. Conclusiones clave En primer lugar, los PLC son la solución técnica óptima para el apagado rápido a nivel de componentes.La especificación SunSpec utiliza explícitamente PLCs como el portador de señal de comunicación, multiplexando líneas de energía de CC para transmitir señales de control,evitando así los riesgos de coste y fiabilidad de colocar líneas de comunicación separadas para cada componente. En segundo lugar, los criterios de aceptación están cambiando de "funcionalidad" a "eficacia medible".Las especificaciones de 30 segundos/80V/30V de la SJG 220-2026 y los requisitos cuantitativos de la norma del grupo de Shanghai significan que el diseño de una solución de apagado rápido debe soportar pruebas in situ. En tercer lugar, la consideración central para la selección del módulo debe cambiar de "parámetros del chip" a "adaptabilidad de la ingeniería".Los tres indicadores de ingeniería: limitaciones de espacio de la unidad de apagado, limitaciones de consumo de energía en condiciones de autoalimentación,Las limitaciones de escala de red en escenarios distribuidos son clave para determinar si una solución puede producirse e implementarse en masa.. En cuarto lugar, el conocimiento de los niveles de certificación es una capacidad que los fabricantes de interruptores deben establecer.El soporte de chips para el protocolo SunSpec, la certificación de módulos a través de SunSpec y la certificación completa de la unidad a través de los estándares de seguridad UL 1741 son tres niveles de verificación independientes.El chip Hisilicon PS0211 indica explícitamente el soporte para el estándar SunSpec, y el módulo Qogrisysy 3121N-H, basado en este chip, proporciona una garantía fundamental a nivel de protocolo para la certificación de la unidad completa de los fabricantes de interruptores. En quinto lugar, el papel de los proveedores de módulos se está expandiendo de "entrega de dispositivos" a "asistencia en la certificación".Los fabricantes de switches necesitan más que "módulos utilizables"; necesitan socios técnicos que puedan "ayudar a comprender la lógica de prueba de SunSpec, optimizar el diseño de redes del sistema,y ayudar a aprobar la certificación general del sistema."